Comment 6 for bug 1618230

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Seth Hillbrand (sethh) wrote :

@Tom- Pad stacks are on our road map for v6. No ETA for that.

As a work around, you can stack your pads by placing a THT pad with minimal size directly on top of two SMDs (one for F.Cu and one for B.Cu). This will allow you to route the inner layers more closely than the outer layers.

Be aware that most board houses will require some copper on the annular rings just for runout protection, so I'd avoid making the THT copper too thin.