Comment 0 for bug 1618230
Revision history for this message
| Simon Richter (sjr) wrote Reduce impact of thru-hole pads and vias on inner layers | #0 |
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When a via or thru-hole pad is placed, the inner layers will also receive annular rings, even if there are no connections there. That makes it more difficult to route signals between pins.
Ideally, onbly clearance from the drill hole would be required on these layers.