Comment 1 for bug 855988

On Wed, 21 Sep 2011, Stephen Pflanze wrote:

> Public bug reported:
>
> There are ICs that require a thermal pad under them. In recommended footprints this thermal pad also functions as a pin one indicator where either a semi circle is recessed into an edge as shown on page 48 of this document:
> http://www.silabs.com/pages/DownloadDoc.aspx?FILEURL=Support%20Documents/TechnicalDocs/C8051F31x.pdf&src=DocumentationWebPart
> or with a clipped off corner as Mentor Graphics does it as shown for QFN packages in their LP Viewer. A similar way is needed to do this in Kicad.

You can do these composing pads: a trapezoidal pad can be used to make
the triangular part and two other pads will close the rectangle like
this:
      ______
  /| | |
/_| |______|
  __________
| |
|__________|

I've done this for similar QFN and it works perfectly... a 'native' pad
like that could be added as a wishlist item.

--
Lorenzo Marcantonio
Logos Srl