@PCB Wiz
If KiCad features pad stacking, then it's a confirmed bug. If it doesn't then it's a wish. Some headman, please decide..
Anyway the wish is rather "allowing to create different pad shapes on different layers" than allowing pad stacking. I think pad stacking would bring more headaches: how to handle overlapping holes of TH footprints, how to handle stacked components connecting to different nets etc...
@PCB Wiz
If KiCad features pad stacking, then it's a confirmed bug. If it doesn't then it's a wish. Some headman, please decide..
Anyway the wish is rather "allowing to create different pad shapes on different layers" than allowing pad stacking. I think pad stacking would bring more headaches: how to handle overlapping holes of TH footprints, how to handle stacked components connecting to different nets etc...