Comment 13 for bug 1605049

I've added another test case to the Thread.
This shows that Connect-Test for _traces_, does seem smart enough to detect just PAD-Overlap (at least to trace centre / co-ord basis, which is ok ).

However, the copper that makes up the thermals, apparently does not use the same connect test ?
Thermals can well-overlap a PAD, and yet still fail-DRC-connect ?

This gives another possible short-term solution option, which is to fix Thermal-Connect, to be the same test as Trace-connect.
I think the unwanted/unexpected void on a Zero Size pad also needs fixing, but it comes down to what is easiest to do.