solder paste rendered larger than mask
Affects | Status | Importance | Assigned to | Milestone | |
---|---|---|---|---|---|
pcb |
Fix Released
|
Undecided
|
Unassigned |
Bug Description
The solder mask of a pad can be configured smaller than the pad itself. This is useful, if the pad is used as a heat sink. An example is my MMIC footprint according to the specs of Minicircuits: http://
However, the solder paste pattern emitted by pcb does not care for the solder mask. The solder paste always covers the entire pad. For masks smaller than than the pad dimensions this results in solder paste on top of solder mask. This is clearly not useful and results in complains by the fab.
Suggestion: Adjust solder paste size to solder mask dimensions if these are smaller than the pad.
---<)kaimartin(>---
Changed in pcb: | |
status: | New → In Progress |
Changed in pcb: | |
status: | Fix Committed → Fix Released |
This patch against today's GIT head fixes the problem in the way that Kai-Martin suggests.