pcb

Blind/Burried Vias Clear Soldermask on Layers they Don't Intersect

Bug #1767812 reported by Chad Parker on 2018-04-29
8
This bug affects 1 person
Affects Status Importance Assigned to Milestone
pcb
Medium
Milan Prochac

Bug Description

While developing tests for the ChangeClearSize action, I noticed that blind and buried vias will clear soldermask even if they don't intersect the top or bottom. See the attached screenshot. In this screenshot, the top solermask layers is showing. The rows labeled "Buried vias to bot" has vias going from In2 to BOT, and the rows labeled "Blind vias" have vias going from IN1 to IN3. In both cases, these vias do not intersect the top layers, and so there shouldn't be an opening on the soldermask.

Chad Parker (parker-charles) wrote :
Milan Prochac (milan-x) wrote :

Yes, you are right.

Fix seems to be simple. Quick test works, unfortunately I am quite busy now to perform deep systematic tests.

Please apply attached patch and try it.

Wonderful. I've been developing some tests, which is how I found this. I'll
try out your patch this weekend. Thanks for doing it.

On Wed, May 2, 2018, 16:41 Milan Prochac <email address hidden> wrote:

> Yes, you are right.
>
> Fix seems to be simple. Quick test works, unfortunately I am quite busy
> now to perform deep systematic tests.
>
> Please apply attached patch and try it.
>
> ** Patch added: "0001-Mask-over-buried-vias-fix.patch"
>
> https://bugs.launchpad.net/pcb/+bug/1767812/+attachment/5132454/+files/0001-Mask-over-buried-vias-fix.patch
>
> --
> You received this bug notification because you are subscribed to the bug
> report.
> https://bugs.launchpad.net/bugs/1767812
>
> Title:
> Blind/Burried Vias Clear Soldermask on Layers they Don't Intersect
>
> Status in pcb:
> New
>
> Bug description:
> While developing tests for the ChangeClearSize action, I noticed that
> blind and buried vias will clear soldermask even if they don't
> intersect the top or bottom. See the attached screenshot. In this
> screenshot, the top solermask layers is showing. The rows labeled
> "Buried vias to bot" has vias going from In2 to BOT, and the rows
> labeled "Blind vias" have vias going from IN1 to IN3. In both cases,
> these vias do not intersect the top layers, and so there shouldn't be
> an opening on the soldermask.
>
> To manage notifications about this bug go to:
> https://bugs.launchpad.net/pcb/+bug/1767812/+subscriptions
>

Chad Parker (parker-charles) wrote :

Looks to me like it works. I cherry-picked the patch from your "personal_complete" branch into LP1767812.

My tests are in another branch that hasn't been merged yet, so, before merging this into master, I'm going to wait for that branch to get included. Then I can update the golden files in this branch and push both the fix and the updated test files.

Bert Timmerman (bert-timmerman) wrote :

pushed to master.

Changed in pcb:
milestone: none → pcb-4.2.0
status: New → Fix Committed
importance: Undecided → Medium
Chad Parker (parker-charles) wrote :

Milan-

I've "assigned" you to this bug so that you can get credit for fixing it. If you'd prefer I not, then I can remove you.

Thanks,
--Chad

Changed in pcb:
assignee: nobody → Milan Prochac (milan-x)
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