Comment 3 for bug 684067

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Lorenzo Marcantonio (l-marcantonio) wrote : Re: [Bug 684067] Re: Managed to create a via in/on a pad.

On Fri, 17 Dec 2010, Agent24 wrote:

> Just to add, this is not such a problem from an electrical point of view
> since both pad and via are on the same net.
>
> But since I am able to create a via and pad with overlapping drill
> holes... I don't think any PCB fab places are going to like it very
> much.

Overlapping drill holes are bad, indeed :D

But vias on pad are not (for example thermal vias). Of course you have
to handle solder wicking and suck things.

A 'tented via' option would be useful for them (forcing solder mask on
the via)

--
Lorenzo Marcantonio
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