Add design rule settings for blind/buried/microvia stackup
| Affects | Status | Importance | Assigned to | Milestone | |
|---|---|---|---|---|---|
| KiCad |
Fix Released
|
Unknown
|
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Bug Description
Right now, if blind/buried vias are allowed, they can be created between any pair of layers. This can easily lead to a much more expensive design than intended, or even one physically impossible to manufacture.
The board setup dialog should include configuration for sequential lamination / HDI drill stackups, where the user can set the allowed drill diameters separately for each drillable layer pair.
If the user requests a blind/buried via between two layers which cannot be created using the available drill stackups, KiCAD should pop up a message explaining that this is not a valid blind via for the current stackup, and asking if they want to create a through-board via instead.
Blind/buried vias between layers which are a subset of the allowed drills should be extended as needed. For example, if the user has configured blind vias from layer 1 to 4, and requests a blind via from layer 1-2, this should be extended to a 1-4 blind via. Maybe display a quiet notification in the status bar mentioning that this has been done?
| Wayne Stambaugh (stambaughw) wrote | #1 |
| Changed in kicad: | |
| status: | New → Triaged |
| importance: | Undecided → Wishlist |
| milestone: | none → 6.0.0-rc1 |
| KiCad Janitor (kicad-janitor) wrote | #2 |
| Changed in kicad: | |
| status: | Triaged → Expired |
| Changed in kicad: | |
| importance: | Wishlist → Unknown |
| status: | Expired → Fix Released |
@Andrew, did you check to see if this bug hasn't already be proposed. I thought it was but I could be wrong. In any event, pad stacks are on the v6 road map which should cover what you proposed.