Add design rule settings for blind/buried/microvia stackup

Bug #1821801 reported by Andrew Zonenberg on 2019-03-26
26
This bug affects 4 people
Affects Status Importance Assigned to Milestone
KiCad
Wishlist
Unassigned

Bug Description

Right now, if blind/buried vias are allowed, they can be created between any pair of layers. This can easily lead to a much more expensive design than intended, or even one physically impossible to manufacture.

The board setup dialog should include configuration for sequential lamination / HDI drill stackups, where the user can set the allowed drill diameters separately for each drillable layer pair.

If the user requests a blind/buried via between two layers which cannot be created using the available drill stackups, KiCAD should pop up a message explaining that this is not a valid blind via for the current stackup, and asking if they want to create a through-board via instead.

Blind/buried vias between layers which are a subset of the allowed drills should be extended as needed. For example, if the user has configured blind vias from layer 1 to 4, and requests a blind via from layer 1-2, this should be extended to a 1-4 blind via. Maybe display a quiet notification in the status bar mentioning that this has been done?

Wayne Stambaugh (stambaughw) wrote :

@Andrew, did you check to see if this bug hasn't already be proposed. I thought it was but I could be wrong. In any event, pad stacks are on the v6 road map which should cover what you proposed.

Changed in kicad:
status: New → Triaged
importance: Undecided → Wishlist
milestone: none → 6.0.0-rc1
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