| 2017-12-30 21:10:26 |
Nick Østergaard |
bug |
|
|
added bug |
| 2017-12-30 21:10:26 |
Nick Østergaard |
attachment added |
|
Example board file https://bugs.launchpad.net/bugs/1740633/+attachment/5029238/+files/noname.kicad_pcb |
|
| 2017-12-30 21:10:46 |
Nick Østergaard |
description |
When filling the zone with the thermal releif connection type to a multipad it can happen that the zone copper does not actually connect!
See the attached image and minimal example board. |
When filling the zone with the thermal releif connection type to a multipad it can happen that the zone copper does not actually connect!
See the attached image and minimal example board.
Application: pcbnew
Version: (2017-12-30 revision e062780e9)-master, release build
Libraries:
wxWidgets 3.0.3
libcurl/7.57.0 OpenSSL/1.1.0g zlib/1.2.11 libidn2/2.0.4 libpsl/0.19.1 (+libidn2/2.0.4) libssh2/1.8.0 nghttp2/1.28.0
Platform: Linux 4.14.8-1-ARCH x86_64, 64 bit, Little endian, wxGTK
Build Info:
wxWidgets: 3.0.3 (wchar_t,wx containers,compatible with 2.8) GTK+ 2.24
Boost: 1.65.1
Curl: 7.57.0
Compiler: GCC 7.2.1 with C++ ABI 1011
Build settings:
USE_WX_GRAPHICS_CONTEXT=OFF
USE_WX_OVERLAY=OFF
KICAD_SCRIPTING=OFF
KICAD_SCRIPTING_MODULES=OFF
KICAD_SCRIPTING_WXPYTHON=OFF
KICAD_SCRIPTING_ACTION_MENU=OFF
BUILD_GITHUB_PLUGIN=ON
KICAD_USE_OCE=ON
KICAD_SPICE=ON |
|
| 2017-12-30 21:11:06 |
Nick Østergaard |
attachment added |
|
Selection_012.png https://bugs.launchpad.net/kicad/+bug/1740633/+attachment/5029239/+files/Selection_012.png |
|
| 2017-12-30 21:11:32 |
Nick Østergaard |
description |
When filling the zone with the thermal releif connection type to a multipad it can happen that the zone copper does not actually connect!
See the attached image and minimal example board.
Application: pcbnew
Version: (2017-12-30 revision e062780e9)-master, release build
Libraries:
wxWidgets 3.0.3
libcurl/7.57.0 OpenSSL/1.1.0g zlib/1.2.11 libidn2/2.0.4 libpsl/0.19.1 (+libidn2/2.0.4) libssh2/1.8.0 nghttp2/1.28.0
Platform: Linux 4.14.8-1-ARCH x86_64, 64 bit, Little endian, wxGTK
Build Info:
wxWidgets: 3.0.3 (wchar_t,wx containers,compatible with 2.8) GTK+ 2.24
Boost: 1.65.1
Curl: 7.57.0
Compiler: GCC 7.2.1 with C++ ABI 1011
Build settings:
USE_WX_GRAPHICS_CONTEXT=OFF
USE_WX_OVERLAY=OFF
KICAD_SCRIPTING=OFF
KICAD_SCRIPTING_MODULES=OFF
KICAD_SCRIPTING_WXPYTHON=OFF
KICAD_SCRIPTING_ACTION_MENU=OFF
BUILD_GITHUB_PLUGIN=ON
KICAD_USE_OCE=ON
KICAD_SPICE=ON |
When filling the zone with the thermal releif connection type to a multipad it can happen that the zone copper does not actually connect!
See the attached image and minimal example board.
Solid connection type works ok.
Application: pcbnew
Version: (2017-12-30 revision e062780e9)-master, release build
Libraries:
wxWidgets 3.0.3
libcurl/7.57.0 OpenSSL/1.1.0g zlib/1.2.11 libidn2/2.0.4 libpsl/0.19.1 (+libidn2/2.0.4) libssh2/1.8.0 nghttp2/1.28.0
Platform: Linux 4.14.8-1-ARCH x86_64, 64 bit, Little endian, wxGTK
Build Info:
wxWidgets: 3.0.3 (wchar_t,wx containers,compatible with 2.8) GTK+ 2.24
Boost: 1.65.1
Curl: 7.57.0
Compiler: GCC 7.2.1 with C++ ABI 1011
Build settings:
USE_WX_GRAPHICS_CONTEXT=OFF
USE_WX_OVERLAY=OFF
KICAD_SCRIPTING=OFF
KICAD_SCRIPTING_MODULES=OFF
KICAD_SCRIPTING_WXPYTHON=OFF
KICAD_SCRIPTING_ACTION_MENU=OFF
BUILD_GITHUB_PLUGIN=ON
KICAD_USE_OCE=ON
KICAD_SPICE=ON |
|
| 2017-12-30 21:11:42 |
Nick Østergaard |
bug |
|
|
added subscriber Tomasz Wlostowski |
| 2017-12-30 21:12:17 |
José I. Romero |
kicad: status |
New |
Confirmed |
|
| 2017-12-30 21:18:41 |
Nick Østergaard |
kicad: milestone |
|
5.0.0-rc1 |
|
| 2017-12-30 22:00:13 |
Nick Østergaard |
kicad: importance |
High |
Medium |
|
| 2017-12-30 22:00:16 |
Nick Østergaard |
kicad: milestone |
5.0.0-rc1 |
|
|
| 2017-12-30 22:31:08 |
Chris Pavlina |
kicad: importance |
Medium |
Low |
|
| 2018-04-13 23:03:33 |
Jeff Young |
summary |
Zone filling does not attach properly |
Thermal connections unpredictable with overlapping pads |
|
| 2018-12-24 02:38:37 |
Jeff Young |
marked as duplicate |
|
602176 |
|
