Track & via cleanup option to join "near misses"
Affects | Status | Importance | Assigned to | Milestone | |
---|---|---|---|---|---|
KiCad |
Fix Released
|
Wishlist
|
Seth Hillbrand |
Bug Description
This bug report took a long and winding path. It might be better to start at the end, unless you want all the details....
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Original report follows:
Tested on : r7005 and all earlier builds, Win64
See attached images from test case, a picture is worth 1000 words.
This shows
a) approaching shortest trace to pass Connect Test
b) Leaving shortest trace to pass Connect Test
The DRC Connect Test is fine for Trace_to_Pad, where the Trace end-point needs only be inside the Pad area = OK
Even a Leave Trace seems to find the thermal geometry ok, and it connects inside the Pad.
So Trace_to_Thermal looks Ok too.
However, the Thermal Connect test for Thermal_to_Pad is clearly using something else, as thermals that are well inside the Pad area, fail to register as Connected ?
The problem with this, is false reports are generated from thermals that _do_ connect fine.
It requires manual addition of redundant trace segments, in order to pass.
Summary:
DRC Connect of
Trace_to_Pad = OK
Trace_to_
Thermal_to_Pad = Fails.
Changed in kicad: | |
status: | New → Confirmed |
importance: | Undecided → Low |
Changed in kicad: | |
status: | Fix Committed → Fix Released |
Second file added, Trace_to_Pad boundary case (seems to allow only one attach...)