Feature Request: Interconnect Zones with Dense Vias for improved thermal performance

[Michael Heidinger]

Hello,
I would like to request a feature for improving KiCAD. I do density power layouts. Especially on board MosFETs have power losses >2W which can be cooled using zones. To increase performance, you can make two zones on the front and the back. These must be connected using vias.
In the bottom line: I request a feature that looks like here:
http://www.gendreaumicrosystems.com/thermal-vias.htm

Do you think such thing can be possible to implement?

Thanks, Michael

[Ferdinand T. (f-thiessen)]

It is also useful if you have two ground planes (on top and bottom) and on one is a ground island you can connect this per via from the other layer.

So I also like to have this feature (I think eagle has such a feature too).