Blind/Buried vias - new feature
Affects | Status | Importance | Assigned to | Milestone | |
---|---|---|---|---|---|
pcb |
Fix Released
|
Wishlist
|
Bert Timmerman |
Bug Description
New implementation of blind/buried vias (from July 2016)
For more details - see user manual (pcb.pdf)
Implemented features:
- adjusted file format to implement blind/buried vias
- implemented actions to set first/last layer of the via and convert them to TH vias
- added menu items and hotkeys bound to these actions
- extended select actions to cover via type
- connectivity tests adjusted to correctly resolve blind/buried vias
- PS and Gerber exports supports blind/buried vias (remaining export filters are not affected by new via types)
- documentation adjusted
- new tests and golden images provided
Misssing:
- special file naming options in gerber exports
Suggested future enhancements
- definition of allowed layer pairs for blind buried vias and their verification as part of DRC
This implementation is independent of another implementation found here (from 2008); I was not aware of it.
Milan
Changed in pcb: | |
status: | New → Triaged |
Changed in pcb: | |
importance: | Undecided → Wishlist |
Changed in pcb: | |
milestone: | none → pcb-4.0.1 |
Changed in pcb: | |
status: | Fix Committed → Fix Released |
Some more features I forgot to mention:
- blind/buried vias can be automatically created when line drawing moves from one layer to another
- blind/buried vias can be created when line segment is moved to another layer - it affects only newly created vias
- both features are controlled by option
Missing:
- when line segment is moved to another layer, blind/buried vias are not adjusted - feedback from designers using blind/buried vias is necessary as there is several options how to handle it.